BN CAS 10043-11-5 EINECS 233-136-6
Product Name: Boron Nitride.
Chemical formula: BN.
Molecular weight: 24.818.
CAS number: 10043-11-5.
EINECS number: 233-136-6.
Purity: 99.9%.
Particle size: 1um, 10um, 25um, 100nm, 50nm, 20um (can be customized produced according to customer requirements)
Appearance: White powder.
Features: High hardness, good wear resistance, low friction coefficient, good high-temperature stability, good heat shock resistance, high strength, high thermal conductivity, low expansion coefficient, high electrical resistivity, corrosion resistance, microwave or infrared transmission, stable chemical properties.
Application:
1.Used for manufacturing high temperature resistant, corrosion-resistant boron nitride ceramics and boron nitride composite ceramic products.
2.Used as a high-temperature solid lubricant and release agent in casting and injection molding.
3.High thermal conductivity fillers for thermal conductive plastics, thermal conductive rubber, or epoxy resins.
4.Used as insulation material for high-voltage, high-frequency electricity and plasma isolation.
5.The main raw material used for manufacturing vacuum aluminum plating evaporation boats.
6.Catalyst for preparing cubic boron nitride.
7.Used for high-temperature resistant lubricating coatings and advanced lubricating oil additives.
8.Used for various high-temperature, corrosion-resistant, and anti-oxidation coatings.
9.Structural materials for atomic reactors and rocket engine units.
10.Used as a cosmetic additive.
11.Used for high-temperature solid lubricants, tool materials, abrasives, resistor materials, heat sealing desiccants for transistors, additives for polymers such as plastic resins, heat shielding materials in the aerospace industry, boron nitride products, drill bits, grinding materials, cutting tools, mechanical components, cutting tools, thermal conductivity materials, resistor materials, solid-state doping materials for semiconductors, anti sticking agents, laser anti-counterfeiting aluminum plating, trademark hot stamping materials, etc.