High Purity Ultrafine Micron Nano Indium In Metal Powder CAS 7440-74-6 EINECS 231-180-0

Product name: High purity indium powder.
Appearance: Silver gray powder.
Chemical formula: In.
Atomic weight: 114.82.
CAS number: 7440-74-6.
EINECS number: 231-180-0.
Density: 7.31g/cm3.
Melting point: 156.61°C.
Boiling point: 2080°C.
Resistance: 8.37 mΩ cm.
Purity: 99.99%-99.999%.
Particle size: -200 mesh (can be customized produced according to customer requirements).
Characteristic:
1.Indium is a silver white, easily melted metal with a high boiling point, is very soft, and has good plasticity. Indium can also undergo recrystallization at room temperature. Therefore, in a cold state, there is no hardening phenomenon during processing.
2.Indium has a conductivity roughly four fifths lower than copper, and its coefficient of thermal expansion is almost twice that of copper. The chemical properties of indium are similar to iron, and its atomic radius is similar to cadmium, mercury, and tin. Indium, zinc, and iron often form homomorphic compounds together.
3.Indium is stable in air, and when heated above its melting point, it oxidizes to In2O3. Dense indium is actually not corroded in boiling water and some alkaline solutions. Indium powder grade sponge indium will oxidize to indium oxide in water in the presence of oxygen.
4.Indium can dissolve in various concentrations of inorganic acids such as sulfuric acid, hydrochloric acid, and nitric acid. However, as the purity of indium increases, its rate of interaction with air and acid greatly decreases. When it interacts with acid, its dissolution accelerates with increasing acidity and heating.
5.Indium powder has high purity, uniform particle size, easy dispersion, and high surface activity.
Application:
1.Electronic conductive paste used for silicon solar cells.
2.Used for the manufacturing of fusion materials, various alloys (such as bearing alloys, low melting point alloys, anti-corrosion alloys, dental alloys, and alloy coatings).
3.Used as a thermal fuse and solder, lead-free solder paste, electronic conductive paste.
4.Used as a sealing component in the vacuum field and as an adhesive material in acoustic sensors.
5.Used as a substitute for mercury in lighting.
6.Used as transparent electrodes (ITO film), soldering materials in the electronics industry, low melting alloys, bearings for high-performance engines, seals in low-temperature and vacuum fields, soluble anodes, and control rods for nuclear reactors.
7.Used for manufacturing various alloys, special soldering materials, coatings, electronics, and producing high-purity indium.
8.Used for semiconductors, coatings, lubricants, anti-static materials, etc.
